| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical communication module capable of manufacturing a resin package easily even in upsizing, and to provide a method of manufacturing such an optical communication module. <P>SOLUTION: The optical communication module 4 has a substrate 11 in a rectangular plate shape. A photodiode is arranged on one surface 13 of the substrate 11, and one surface 13 of the substrate 11 and the photodiode are sealed with the resin package 12. On a light incidence surface 14 at a side opposite to a surface in contact with the substrate 11 of the resin package 12, a condensing lens 6 is arranged to condense parallel light emitted from the optical communication module at a transmission side to the photodiode. On both sides 16, 17 along the longitudinal direction of the resin package 12, a groove 18 is formed in a rectangular form when a light incidence surface 14 is looked down vertically. The groove 18 has already been formed when the original of the resin package 12 is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
