| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board not allowing a swelling to occur even if baked in a non-oxidation atmosphere. <P>SOLUTION: A method of manufacturing a wiring board includes: a step A of preparing a green sheet A mainly composed of a glass powder A that is crystallized during baking and containing an organic binder, and a green sheet B mainly composed of a glass powder B and containing the organic binder; a step B of forming a wiring layer mainly composed of copper on at least one surface of the green sheet A and the green sheet B; a step C of preparing a laminated body by laminating the green sheet A and the green sheet B, with the green sheet A disposed on an outermost layer; and a step D of baking the laminated body at a baking temperature from 750 to 1,000°C in a non-oxidation atmosphere. The glass powder A is used with a minimum viscosity of ≥10<SP>6</SP>Pa s during baking, and crystallinity of ≥90 mass% after baking. <P>COPYRIGHT: (C)2008,JPO&INPIT |
