| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device capable of efficiently inspecting a wafer including a peripheral region outside a chip region, and a semiconductor device manufacturing method for performing such an inspection to efficiently manufacture a semiconductor device in high yield. SOLUTION: A defect inspection is performed for a chip region of a wafer (step S1). Based on the result, defect density D<SB>0p</SB>of chips near periphery, located near a wafer peripheral region of the chip region, is calculated (step S3). Chips of high defect density D<SB>0p</SB>are selected (step S6), and the defect inspection is performed again for the wafer peripheral region outside the selected chips near periphery (step S7). The defect inspection is performed only for the region, of the wafer peripheral region, outside the selected chips near periphery based on the defect density D<SB>0p</SB>, thus making it possible to enhance efficiency in wafer inspection. COPYRIGHT: (C)2008,JPO&INPIT
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