发明名称 |
Leadframevorrichtung und entsprechendes Herstellungsverfahren |
摘要 |
A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made of silicon which is mounted in the die pad area on the lead frame to accommodate the chip. |
申请公布号 |
DE19808193(B4) |
申请公布日期 |
2007.11.08 |
申请号 |
DE1998108193 |
申请日期 |
1998.02.27 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
WEIBLEN, KURT;PINTER, STEFAN;HAAG, FRIEDER |
分类号 |
H01L23/50;B81B7/00;H01L21/60;H01L23/12;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|