PREPREG, AND PROCESS FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg which can facilitate manufacture of a printed wiring board excellent in all aspects of rigidity, peeling strength of plating, and insulation reliability. SOLUTION: The prepreg 3 is produced by immersing a resin composition 1 into fibrous substrate 2 and then drying it. The resin composition 1 is prepared by blending a component dissolving easily into roughening solution containing one or both of acid and oxidizing agent, and resin not dissolving easily into roughening solution. The fibrous substrate 2 used has a thickness of 0.1 mm or less. Content of resin is 60-90 mass% for the whole quantity of prepreg 3. COPYRIGHT: (C)2008,JPO&INPIT