发明名称 Laser machining apparatus and method for manufacturing a multilayered printed wiring board
摘要 <p>A laser processing apparatus comprising a processing laser source (60,360), a scanning head (370A) for deflecting the direction of laser beam to the X-Y directions and an X-Y table (380) for placing a work piece to process said work piece with the laser beam by controlling the X-Y table and the scanning head, wherein at least two or more scanning heads (370A,370B) are provided, a beam splitter (364) is provided between said processing laser source and an optical path of the scanning head and the laser beam is distributed by this beam splitter to supply to each scanning head.</p>
申请公布号 EP1852208(A2) 申请公布日期 2007.11.07
申请号 EP20070113886 申请日期 1997.11.14
申请人 IBIDEN CO., LTD. 发明人 HIRAMATSU, YASUJI
分类号 B23K26/067;B23K26/04;B23K26/06;B23K26/08;B23K26/38;H05K1/02;H05K3/00;H05K3/46 主分类号 B23K26/067
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