发明名称 DIPPING DETECTING DEVICE OF SEMICONDUCTOR DEVICE, DIPPING EQUIPMENT OF SEMICONDUCTOR DEVICE COMPRISING THE SAME DETECTING DEVICE, AND METHOD OF DETECTING DIPPING STATE OF SEMICONDUCTOR DEVICE USING THE SAME DETECTING DEVICE
摘要 A dipping detecting device for semiconductor devices, a dipping equipment for the semiconductor devices, and a method of detecting a dipping state of the semiconductor devices are provided to detect a dipping defective of the semiconductor devices by detecting flow of an electric current during a dipping process. A conductive gripper(100) for a first electrode picks up a semiconductor device so that the semiconductor device is dipped in a dipping solution. A conductor(200) for a second electrode is formed on a side of the gripper, and is electrically isolated from the gripper. A power source(300) is connected to the gripper and the conductor to apply an electric power to the gripper and the conductor and detect flow of the power. The power source has a PLC(Programmable Logical Controller) module(320) or a DC or AC current supplying unit and an I/O(Input/Output) unit detecting flow of the current.
申请公布号 KR100771885(B1) 申请公布日期 2007.11.01
申请号 KR20060091693 申请日期 2006.09.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 ROH, DONG JOO;SUN, YONG KYUN;KO, YOUN SUNG
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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