发明名称 PLASMA APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma apparatus capable of enlarging the region for a heating process while suppressing a power source output, and capable of surely heating at a target process temperature by a simple control. <P>SOLUTION: In a plasma apparatus, a plasma generating space 21 is supplied with a specified gas, and a voltage is applied between a pair of plate-like members 23 and 24 through a pair of electrodes 25 and 26 for generating plasma. A work 100 is heated with the plasma. It comprises at least either a first temperature detecting means or a second temperature detecting means, an interval distance adjusting means, and a control means. The control means, based on the detection result of the first temperature detecting means and/or the second temperature detecting means, controls operation of the interval distance adjusting means, so that the process temperature at heating is a target process temperature for adjusting distance between a plasma emission outlet 211 and a processed 101. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007287454(A) 申请公布日期 2007.11.01
申请号 JP20060112765 申请日期 2006.04.14
申请人 SEIKO EPSON CORP 发明人 MORI YOSHIAKI;OTA TOSHIHIRO;SAIBA KOJI
分类号 H05H1/24 主分类号 H05H1/24
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