| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing die and a resin sealing method in which uniform temperature distribution is attained along the longitudinal direction of a substrate when a chip attached to the substrate is resin sealed. SOLUTION: In one die 111 for arranging a sheet of substrate 400, a plurality of heaters H (H1-H4) extending along the short side direction S of each substrate 400 are arranged along the long side direction L thereof. Since the temperature of each heater H (H1-H4) becomes substantially constant excepting the opposite ends thereof, temperature distribution on the die surface (substrate supply set surface 113) is made uniform along the long side direction L of the substrate 400 on the substrate surface. COPYRIGHT: (C)2008,JPO&INPIT
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