| 摘要 |
PROBLEM TO BE SOLVED: To equalize case surface temperature by suppressing local temperature rise on the surface of the case without requiring complicated structure, and also possible to be utilized as a case exterior board with mechanical strength. SOLUTION: A tabular member 10 is formed in a tabular shape by hardening binder resin 18 in a state where two or more layers of copper wires are laminated in a thickness direction while two or more linear-shaped copper wires 12 covered with an insulating film 16 are arranged in a plane direction. In an electronic device heat dissipation structure, the tabular member 10 wherein the thermal conductivity in the plane direction along the copper wire 12 is higher than that of the thickness direction equipped with a high anisotropy thermal conduction structure, for example, is used as a case exterior board, and a heating element is fixed in the interior side. Therein, the heat dissipation board may be arranged fixedly in a state where the board is brought into contact with the copper wire exposure end surface of the tabular member 10. COPYRIGHT: (C)2008,JPO&INPIT |
