摘要 |
The present invention provides ceramic circuit substrate which is sintered at 900 to 1,050 DEG C and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing the same. <??>A glass is employed as row material, of which softening point is 850 to 1,100 DEG C, that is, a glass having a composition included in an area in Fig. 1 (triangular composition diagram of SiO2-B2O3-R2O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively. <IMAGE> |
申请人 |
HITACHI LTD. |
发明人 |
TANEI, HIRAYOSHI;IWANAGA, SHOICHI;OKAMOTO, MASAHIDE;NAKAMURA, MASATO;MORITA, KOUSAKU;ISHIHARA, SHOUSAKU;KOBAYASHI, FUMIYUKI;TAGAMI, FUMIKAZU;SENGOKU, NORIO;FUJITA, TSUYOSHI |