ELECTRONIC DEVICE HOUSING

摘要

An apparatus and methods are provided for housing an electronic device (106) In one implementation, a method of housing (102) an electronic device includes positioning an electronic device on a base, over-molding a lid onto at least a portion of the base and a portion of the electronic device (106), the lid and the base comprising a housing for the electronic device, and over-molding a movable component to a portion of the housing In another implementation a method for housing an electronic device includes positioning a housing for an electrical device(106) within a first mold cavity of an assembly mold (108), the housing including a base and a lid, molding a movable component in a second mold cavity (104) of the assembly mold, and attaching the movable component to the housing while both the movable component (108) and the housing are within the assembly mold.