| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component pickup apparatus that enables an imaging state, in which electronic components held by an adhesive sheet are imaged, to be stabilized, and to provide an electronic component pickup method. SOLUTION: In an electronic component pickup operation for picking up and absorbing a plurality of electronic components 6 held by the adhesive sheet 5, a first camera 35 for identifying electronic components is moved beyond the electronic components 6 to be absorbed, and a lower supporting unit 8 is sequentially moved below the electronic components 6, before they are absorbed by a plurality of nozzles of the work head, to image the electronic components 6 which are kept in a horizontal position by a supporting surface 14a on the upper surface of the lower supporting unit 8. This makes it possible to stabilize an imaging state in which the electronic components 6 held by the adhesive sheet 5 are imaged, to secure precision in position detection, and thereby to reduce errors in picking up the electronic components. COPYRIGHT: (C)2005,JPO&NCIPI |
