| 摘要 |
A circuit device is provided to improve the reliability of a circuit device by controlling delamination of a sealing resin layer in a pad electrode part. An interconnection layer(3) made of copper is formed on a substrate. An insulation resin layer(5) is formed on the substrate and the interconnection layer, having an opening in an electrode formation region. A gold plating layer(4) is formed in a part of the surface of the interconnection layer in the opening where the part of the surface of the interconnection layer is provided for electrical connection. A circuit device(6) is formed in the substrate. The circuit device and the interconnection layer are electrically connected by a conductive member(7) by interposing the gold plating layer. A sealing resin layer(8) is formed on the insulation resin layer, sealing the formation region of the circuit device and the electrode. The sealing resin layer comes in contact with the gold plating layer and the interconnection layer. The surface of the interconnection in contact with the sealing resin layer can be roughened. |
