发明名称 CERAMIC CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a ceramic circuit board which has projections of a brazing material with less variations in the length of the projections and without degrading an electric insulation property thereof. SOLUTION: An active metal brazing material 2 is printed, and then stopper materials 3 lower than the height of the brazing layer after joined thereto are provided to be spaced from ends of the brazing material layer. Therefore a chemical processing time required for brazing material removal, chemical polishing, etc. is reduced. A variation in the length of the brazing material projections 7 is set not to be larger than 200μm and a surface modification layer of a ceramic board 1 is set to have a maximum thickness not larger than 15μm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281219(A) 申请公布日期 2007.10.25
申请号 JP20060106046 申请日期 2006.04.07
申请人 HITACHI METALS LTD 发明人 FUJITA TAKU;IMAMURA TOSHIYUKI;WATANABE JUNICHI
分类号 H05K3/06;B23K1/00;B23K1/19;B23K101/42;C04B37/02;H01L23/12;H05K1/02 主分类号 H05K3/06
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