SURFACE MOUNTING LIGHT EMITTING DIODE DEVICE

摘要

A surface mounting light emitting diode device is provided to improve a manufacturing yield by forming a surface unevenness through an ion beam etching process. A surface mounting light emitting diode device includes a lead frame, a package(120), and an LED chip(140). The lead frame is formed by a pair of lead terminals(130). The package receives a portion of the lead frame inside thereof. The package(120) is formed to have a radiation window for emitting lights. The LED chip is mounted on the lead frame inside the package. A wire(150) electrically conducts the LED chips and the lead frame. The molding material fills the package and has a surface uneven structure of a predetermined shape at a surface exposed through the radiation window of the package.