发明名称 |
METHOD OF MANUFACTURING SUBSTRATE INCORPORATING SOLID ELECTROLYTIC CAPACITOR |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate incorporating an electrolytic capacitor capable of manufacturing the solid electrolytic capacitor precisely and easily. <P>SOLUTION: The compact solid electrolytic capacitor having a large capacity comprising a solid electrolyte layer and a collector layer formed on metal foil having valve operation is built into an electrically insulating substrate, and is connected to an inner via by a through-hole electrode, thus miniaturizing a packaging area having short wiring and realizing the manufacturing method of the substrate incorporating an electrolytic capacitor having low-impedance characteristics. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2007281109(A) |
申请公布日期 |
2007.10.25 |
申请号 |
JP20060103774 |
申请日期 |
2006.04.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ISHITOMI HIROYUKI;MIKI KATSUMASA;SUGAYA YASUHIRO;HIMORI GOJI |
分类号 |
H05K1/16;H01L23/12;H05K3/46 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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