| 发明名称 |
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING |
| 摘要 |
<p>Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains abrasive grains (A), an organic acid (B), a water-soluble polymer (C), an oxidizing agent (D) and water (E). The weight average molecular weight of the water-soluble polymer (C) is 50,000-5,000,000.</p> |
| 申请公布号 |
WO2007116770(A1) |
申请公布日期 |
2007.10.18 |
| 申请号 |
WO2007JP56501 |
申请日期 |
2007.03.27 |
| 申请人 |
JSR CORPORATION;TAKEMURA, AKIHIRO;SHIDA, HIROTAKA;IKEDA, MASATOSHI |
发明人 |
TAKEMURA, AKIHIRO;SHIDA, HIROTAKA;IKEDA, MASATOSHI |
| 分类号 |
H01L21/304;B24B37/04;C09K3/14 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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