| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having an electric fuse configuration which can be cut by supplying a current without damaging a peripheral part. <P>SOLUTION: An electric fuse 10 is electrically connected between an electronic circuit and a redundancy circuit serving as a spare of the electronic circuit, and can be cut by supplying a current from the outside after the circuits are sealed with resin. The electric fuse 10 is provided in a fine layer and formed of main wiring 1 and a barrier film 3. Coefficients of the linear expansion of the main wiring 1 and the barrier film 3 are larger than those of insulating layers 2, 4 and 5 formed around the main wiring 1 and the barrier film 3. Further, melting points of the main wiring 1 and the barrier film 3 are lower than those of the insulating layers 2, 4 and 5. <P>COPYRIGHT: (C)2008,JPO&INPIT |
