| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a waxless-mount type polishing method which can prevent the peripheral standing edge of a semiconductor wafer in an easy way and at a low cost, regardless of the loosening of the semiconductor wafer in a template during polishing. <P>SOLUTION: A periphery of a silicon wafer W is made to protrude toward a polishing cloth 13 than to the center thereof by an easy and low cost method, wherein a spacer 16 is removably stuck to the backside of the periphery of the silicon wafer W. Then the wafer W is polished. With such an arrangement, the peripheral standing edge of the silicon wafer W can be prevented regardless of the loosening of the silicon wafer W in a template 14 during polishing. <P>COPYRIGHT: (C)2008,JPO&INPIT |
