| 摘要 |
A metal layer (16) is bonded to a ceramic substrate (12) in a method, wherein a first metal layer (13) (e.g., a copper film) is first applied to a surface of the ceramic substrate (e.g. Al N). The ceramic substrate (12), with the first metal layer (13) applied thereto, is then heated in an atmosphere including oxygen (e.g., to a temperature below the eutectic temperature of the metal oxide) to form an adhesion-promotion layer (14). A second metal layer (16) (e.g., a copper foil) is then bonded to the adhesion-promotion layer (14). Where the metal is copper, the adhesion promotion layer (14) can include copper oxide and copper aluminum oxide. |
