发明名称 CERAMIC SHEET LAMINATE CUTTING METHOD, CERAMIC ELECTRONIC COMPONENT MANUFACTURING METHOD USING THE SAME AND CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a ceramic sheet laminate cutting method high in cutting accuracy and cutting efficiency, a cutting device, and a ceramic electronic component manufacturing method using the cutting method. SOLUTION: A ceramic sheet laminated body 100 is composed so that a plurality of cutting marks are formed on the end face at regular intervals, and internal electrodes are exposed on the four side faces. An inspection part 10 images the cutting marks and the internal electrodes so as to calculate a distance between a cutting position passing through a middle point between the internal electrodes adjacent to each other and each cutting mark as a relative cutting position. A cutting part 50 calculates a gravity center of each cutting mark by imaging each cutting mark so as to cut the ceramic sheet laminated body 100 at the cutting position corresponding to the relative cutting position calculated by the inspection part 10 and the calculated gravity center. It is possible to execute parallel processing of inspection and cutting while improving the cutting accuracy, since it is required to image only the cutting marks during cutting. Consequently, it achieves high work efficiency. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273601(A) 申请公布日期 2007.10.18
申请号 JP20060095496 申请日期 2006.03.30
申请人 TDK CORP 发明人 MINAGAWA KEIJI;ABE TATSU;ITO MASATOSHI;TATSUMI SUMIYUKI;SHINDO HIROSHI
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
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