| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package with high speed and high performance capable of minimizing a characteristic deterioration of a semiconductor chip by packaging. <P>SOLUTION: The semiconductor package includes: a semiconductor chip 30 having a bonding pad 31; a re-wiring layer 38 formed on the semiconductor chip 30 so as to be connected to the bonding pad 31; a window 41 from which the re-wiring layer 38 is exposed; a substrate 40 attached onto the semiconductor chip 30; a connecting member 50 electrically connecting the bonding pad 31 of the semiconductor chip 30 and the substrate 40; a sealing agent 60 for sealing the window 41 including the connecting member 50, and a substrate surface including the semiconductor chip 30; and a solder ball 70 attached to the substrate 40. <P>COPYRIGHT: (C)2008,JPO&INPIT |
