| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic-component mounting substrate that has a small deformation of an electronic-component mounting region. SOLUTION: The manufacturing method is provided with a step in which the electronic-component mounting region 2, a frame-like region 3 surrounding the electronic-component mounting region 2, and a frame-like ceramic green sheet laminating region 4 surrounding the frame-like region 3, are provided on a first ceramic green sheet 1, and through-holes 5 forming a shape along the electronic-component mounting region 2 are formed in the frame-like region 3; a step for manufacturing a second ceramic green sheet 6 having a shape corresponding to the ceramic green sheet laminating region 4; a step for forming a laminated body 7 by laminating and pressing the second ceramic green sheet 6 in the ceramic green sheet laminating region 4 of the first ceramic green sheet 1; and a step for baking the laminated body 7 after an appropriate period of time. It is possible to suppress the deformation of the electronic-component mounting substrate since extension of the first ceramic green sheet 1 is absorbed by the deformation of the through-holes 5. COPYRIGHT: (C)2008,JPO&INPIT
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