| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of shortening a time required for transfer in forming a thin-film device using a transfer technique. SOLUTION: The technique includes a step of forming an object to be transferred on a first substrate via a first peeling layer; a step of joining a temporary transfer substrate provided with a second peeling layer on its one surface side, and having a plurality of through-holes to the first substrate, in a direction where the object to be transferred opposes the peeling layer, via a solvent-soluble adhesive containing a light shielding material; a step of causing peeling by giving energy to the first peeling layer, and transferring the object to be transferred to the temporary transferring substrate; a step of joining the temporary transfer substrate to the second substrate, so that the one surface of the temporary transfer substrate opposes the one surface of the second substrate; a step of causing peeling by giving optical energy to the second peeling layer; and a step of removing the adhesive by supplying a solvent to the adhesive through the plurality of through-holes of the temporary transfer substrate, and transferring the object to be transferred from the temporary transfer substrate to the second substrate. COPYRIGHT: (C)2008,JPO&INPIT
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