| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid for a metal which has a high chemical mechanical polishing speed, has improved planarity with less dishing, can improve copper/tantalum selectivity, and enables to manufacture an LSI. SOLUTION: The polishing liquid contains an amino acid derivative in which at least one cyano group is introduced, and an oxidizing agent. COPYRIGHT: (C)2008,JPO&INPIT
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