| 摘要 |
A flip chip substrate comprises a substrate that is defined a chip connect zone which has a plurality of first conductive pads and passive component connect zone which has at least a second conductive pads. A first patterned insulating layer within opening that covers on the chip connect zone and exposed to the first conductive pads, a second patterned insulating layer within opening that covers on the passive component connect zone and exposed to the second conductive pads, to enhance the reliability of chip package.
|
