| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a probe card capable of reducing a deformation and a warpage generated by contact pressure resulting from pressing with a probe when inspected, to enhance inspection reliability, and capable of coping with formation of a narrow pitch for electrodes in a semiconductor integrated circuit of an inspection object. SOLUTION: This substrate for the probe card is constituted by layering sequentially a plurality of resin layers 2 comprising a plurality of conductor patterns 6 and a resin 2a, and a plurality of support layers 3 formed with penetrated-through conductors 7 connected electrically to the conductor patterns 6, and having a Young's modulus higher than that of the resin layer 2. COPYRIGHT: (C)2008,JPO&INPIT
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