SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PDP DRIVER AND PLASMA DISPLAY PANEL

摘要

In a semiconductor integrated circuit device, temperature increase of a bonding wire can be suppressed even when conductive leads are short-circuited each other, and reliability of the semiconductor integrated circuit device is improved. The conductive leads of a resin package for supplying a power supply section of a semiconductor integrated circuit chip with power from an external power supply are connected with the bonding pads of the semiconductor integrated circuit chip by a plurality of bonding wires. Furthermore, the conductive leads connected to a GND for supplying the power supply section of the semiconductor integrated circuit chip with a grounding potential are connected with the bonding pads of the semiconductor integrated circuit chip by a plurality of bonding wires.