SEMICONDUCTOR DEVICE, LAMINATED SEMICONDUCTOR DEVICE USING THE SAME, BASE SUBSTRATE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device high in connection yield and connection reliability between the semiconductor device and a mounting substrate and between the semiconductor devices, even if warpage of the semiconductor device occurs when achieving a thickness-reduction and high density of a semiconductor, a laminated semiconductor device using the same, a base substrate, and a semiconductor device manufacturing method.

SOLUTION: The semiconductor device 10 is composed so that a plurality of external-connection lands 1 for external-connection terminals 2 to electrically connect with external members are arrayed on the base substrate 3. Each external-connection land 1 has a different height corresponding to its arrayed place in accordance with the warpage of the base substrate 3 during mounting.

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