| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for polishing wafer, with which plural steps of polishing are executed using one polish table, when polishing plural kinds of films of a semiconductor wafer, the apparatus can be configured compact, further, the thickness of the film can be measured easily during polishing, and improvement in the throughput of wafer polishing can be expected. SOLUTION: This apparatus is provided with a polish table 10-1, having a polishing plane 10-1a and a top ring 10-2 for holding the wafer and in the wafer-polishing method for pressing the wafer to be polished (semiconductor wafer W), held by the top ring on the polishing plane 10-1a of the polish table 10-1 and polishing the wafer to be polished by relatively moving the wafer to be polished and the polishing plane, the wafer to be polished held by the top ring 10-2 is polished, while being overhung from the polishing plane of the polish table 10-1 for a prescribe quantity. |
