REMOVAL PROFILE TUNING BY ADJUSTING CONDITIONING SWEEP PROFILE ON A CONDUCTIVE PAD

摘要

A method for controlling a removal profile by adjusting a conditioning sweeping profile on a conductive pad is provided to maintain the optimum polishing quality by selectively conditioning a local area of a processing surface of the pad. A method for controlling a removal profile by adjusting a conditioning sweeping profile on a conductive pad includes the steps of: determining an input thickness profile of a substrate(520); setting conditioning parameters on the basis of the thickness profile(530); and conditioning a processing surface of a polishing pad on the basis of the conditioning parameters(540). The step of determining the input thickness profile of the substrate includes the step of determining the thickness profile of a conductive material over the surface of the substrate.