发明名称 FILM-FORMING COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a film-forming composition which gives excellent film characteristics such as permittivity and mechanical strength, when used in electronic devices and yields a favorable film, even after stored over time, an insulation film obtained by using the composition and electronic devices equipped with the film. <P>SOLUTION: The film-forming composition contains a cage-type compound and a thermally decomposable compound. The insulation film is obtained by using the composition. The electronic devices are equipped with the film. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007254551(A) 申请公布日期 2007.10.04
申请号 JP20060079309 申请日期 2006.03.22
申请人 FUJIFILM CORP 发明人 HIRAOKA HIDETOSHI
分类号 C08L49/00;C08F36/20;C08F38/02;C08J5/18;C08K5/14;C08L25/04;C08L47/00;H01L21/312 主分类号 C08L49/00
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