发明名称 RESIN-MOLDING MOLD
摘要 PROBLEM TO BE SOLVED: To provide a resin-molding mold being reduced in the occurrence of void in resin molding and can be used for improving reliability of a molded product. SOLUTION: The resin-molding mold is composed of a fixed side mold 1 and a movable side mold 2 having space parts 5, 6 respectively. The resin-molding mold comprises a cavity 7 formed by the abutment of the fixed side mold 1 and the movable side mold 2, a gate 8 communicating with the cavity 7, a runner 9 communicating to the gate 8, and an over flow 11 communicating with the corner part 13 of the cavity 8 at the position opposed to the gate 8. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007253587(A) 申请公布日期 2007.10.04
申请号 JP20060084582 申请日期 2006.03.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHIKAWA AKIRA;KITAGAWA TOMOKAZU
分类号 B29C45/34;B29C45/26 主分类号 B29C45/34
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