| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board having sheets of a material laminated continuously and liquid crystal polymers used as insulating layers, which can prevent deformation of wiring circuit layers formed on the surfaces of the wiring board. SOLUTION: The method of manufacturing a multilayer printed wiring board comprises a step of interposing a wiring substrate sheet, which includes wiring circuit layers formed on both sides of the sheet and a first liquid crystal polymer used as an insulating layer, between two conductor layer substrate sheets, each of which includes a conductor layer formed on one side of the sheet and a second liquid crystal polymer having a melting point lower than that of the first liquid crystal polymer and used as an insulating layer, with each second liquid crystal polymer side facing the wiring substrate sheet, and of laminating the sheets continuously by using a roll laminator. After the step, the conductor layers of the two conductor layer substrate sheets are patterned to form wiring circuit layers by a suitable method. COPYRIGHT: (C)2008,JPO&INPIT |
