发明名称 CIRCUIT BOARD LAND CONNECTION METHOD AND THE CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a circuit board land connection method for readily making short-circuiting when land is unnecessary land and avoiding short-circuit in mounting an electronic component. SOLUTION: This method bores a hole 3 between the paired lands 2, in such a way that a conductor 4 for short-circuit is exposed via the hole 3 from within a circuit board 1. When the land is not required, it fills a solder paste in the hole 3 and then fuses it there to short-circuit the lands 2. When an electronic component is to be mounted, it uses the hole 3 to prevent a capillary phenomenon to avoid unnecessary short-circuit. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258654(A) 申请公布日期 2007.10.04
申请号 JP20060114995 申请日期 2006.03.22
申请人 TAIYO YUDEN CO LTD 发明人 YUASA MINORU;SHIMAMURA MASAYA
分类号 H05K3/34;H05K1/02 主分类号 H05K3/34
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