| 摘要 |
PROBLEM TO BE SOLVED: To obtain a smooth polished surface in processing of an electronic device formed by various materials having different hardnesses, and to satisfy a specific characteristic required by the device. SOLUTION: A polishing tool is manufactured through a substrate polishing process for smoothing the surface of a substrate, the process for forming a polishing grain layer used for polishing the surface of the electronic device on the substrate, and a surface processing process for making polishing grains project on the surface of the polishing grain layer. Thus, a smooth polishing of the device can be obtained so that the surface of the polishing tool and a polished section of the device are brought into contact with each other and slid with each other. COPYRIGHT: (C)2008,JPO&INPIT
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