发明名称 Soldering apparatus
摘要 <p>An R-ALIP type electromagnetic pump (300) having an inner core (303), a linear pipe (302), and a combination of an outer core (301 a) and coils (301 b) provided around the linear pipe (302) is disposed outside a solder vessel (101) containing a molten solder (100). The solder vessel (101) has a bottom wall (101 a) made of an iron having at least 100 times as high a magnetic permeability as that of the molten solder (100) and having a magnetic permeability not less than that of the inner core (303) and a wall thickness not less than that of the inner core (303) so that a magnetic field from the R-ALIP type electromagnetic pump (300) cannot leak into the solder. Therefore, a stray current derived from an alternating magnetic field can be prevented from spreading in the molten solder (100). </p>
申请公布号 EP1769874(A3) 申请公布日期 2007.10.03
申请号 EP20060254968 申请日期 2006.09.26
申请人 NIHON DEN-NETSU KEIKI CO., LTD. 发明人 TOBA, HIDEAKI
分类号 B23K3/06 主分类号 B23K3/06
代理机构 代理人
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