| 摘要 |
A micro-generator comprises an integrated circuit (IC) wafer. A micro-electro mechanical system (MEMS) wafer is bonded to the IC wafer and comprises a micromechanical element arranged to move in use. A plurality of first metal coils with associated plural trenches are realised as part of the IC wafer and/or the MEMS wafer. Plural micro-magnets are provided, one associated with each trench and are formed from a magnet layer deposited, plated or bonded to the MEMS wafer or IC wafer. Movement of the micro-mechanical element, in use, generates a voltage in the coils. |
