| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP pad conditioner capable of grinding a polishing pad safely and flatly. <P>SOLUTION: A grinding part 2 is formed so that abrasive grains 4 are secured to a base metal 3 by means of blazing. The base metal 3 is composed of a flat part 3a positioned nearer the inside surface and an inclined part 3b nearer the outside circumference, in which abrasive grains 4a having regular shape are secured to the flat part 3a, while to the inclined part 3b, abrasive grains 4b having a shape with pointed crests are secured. The inclined part 3b has a shape thinning toward the outside circumference, in which the difference in the thickness between the outside circumference and the inside surface of the inclined part 3b ranges 10-50% of the mean particle size, including the limits. The dispersion in the tip heights of the abrasive grains 4a secured to the flat part 3a is made no more than 10% of the mean particle size. <P>COPYRIGHT: (C)2007,JPO&INPIT |
