SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To surely taking a wafer out of a pod by hooking a part of the periphery of the wafer with a hooking part. SOLUTION: A wafer transporter 40 is equipped with a tweezers 50 for taking a wafer 1 in/out of a pod 2. The tweezers 50 comprise base end side placements 52 and 52 and tip end side placing parts 54 and 54 for placing the wafer 1 and base end side displacement preventing parts 53 and 53 and tip end side hooks 55 and 55 for hooking the periphery of the wafer 1. The tip end side hooks 55 and 55 are so designed that an included angleΘb with the placement surface of the tip end side placing parts 54 and 54 is right or acute angle, with the height h from the placement surface being designed at least a half of thickness (t) of the wafer 1. COPYRIGHT: (C)2007,JPO&INPIT