| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for electronic equipment that can decrease the temperature rise of a heating element such as a CPU and has a high performance and excellent in reduction of costs. SOLUTION: The cooling device is comprised of a first heat exchanger for receiving heat of a heat generating body, a second heat exchanger for radiating heat that is conveyed by a liquid refrigerant and a piping member for circulating the liquid refrigerant. The heat exchanger is comprised of a frame to be sealed to distribute the liquid refrigerant and a distributing member comprised of a plurality of distributing wall pieces arranged in parallel to separate and distribute the liquid refrigerant in the frame. In the frame, a header is provided among the distributing members to separate or collect the liquid refrigerant, and the distributing wall pieces of the distributing member are arranged on the curved surfaces of the respective wall planes. COPYRIGHT: (C)2007,JPO&INPIT
|
