| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent filling properties and productivity, surely reinforcing a small-sized semiconductor device such as a CSP (chip size package) or an LGA (land grid array) connected onto a wiring board and used as a sealing material having excellent connection reliability during a heat cycle treatment. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent and an inorganic filler and is used for sealing a space between a semiconductor package and a substrate electrically connected to the semiconductor package, The epoxy resin composition is characterized in that the viscosity of the curing agent at 25°C is 0.01-0.6 Pa s. COPYRIGHT: (C)2007,JPO&INPIT
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