| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve photosensitivity of a solid-state imaging element by reducing a plurality of color filter layers in thickness arbitrarily without degradation of optical characteristics when respective color filter layers are formed. <P>SOLUTION: Three color filter layers 19a to 19c are made flat and thin by chemical mechanical polishing while optimizing formed film thickness, formation order, pattern size, chemical mechanical polishing condition and a slurry material (including concentration etc.). Thereby respective three color filter layers 19a to 19c of three primary colors can be formed with desired film thickness and at desired positions and absorption of light by respective color filter layers 19a to 19c can be reduced. Furthermore, a flattening layer 10 under an on-chip lens conventionally needed is eliminated. <P>COPYRIGHT: (C)2007,JPO&INPIT |
