| 摘要 |
PROBLEM TO BE SOLVED: To prevent a mold processing method which can restrain an increase of the number of steps, while being able to prevent a warping of a flexible board. SOLUTION: In the mold processing method, a mold agent A is coated on a reinforcement 106 positioned in the vicinity of a bonding part between a liquid crystal panel 101 and a flexible wiring board 102. This method comprises a hole forming step S1 of forming a plurality of small holes 109 in a mold seam 108 of a flexible wiring board 102W, a coating step of applying the mold agent A from the front side of the reinforcement 106 to coat it to the front side of the reinforcement 106 and the rear side of the reinforcement 106 so as to infiltrate from the plurality of small holes 109, and a curing step of curing the coated mold agent A. COPYRIGHT: (C)2007,JPO&INPIT
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