摘要 |
A semiconductor chip is characterized in that some of the contact points for connecting the semiconductor chip to other components of a system that contains the chip is provided for making a connection with another semiconductor chip that can be mounted onto the first semiconductor chip and that enhances the functions and/or the power of the latter. Such a configuration allows a small semiconductor chip to be produced in a cost-effective manner, using minimal resources and the chip can be enhanced by any number of modules, without modifying the characteristics of the system, in which it is contained. |