IMAGE DISPLAY

摘要

PROBLEM TO BE SOLVED: To provide a structure surrounding a driver IC to quickly suppress its heat lower than a certain temperature and to improve its heat dissipation by an easy method in order to protect it from thermal damage when building an FED panel in a display, and to provide a mechanism robust against impact.

SOLUTION: The edge of the panel reinforcement is folded back in a letter L to bring the driver IC into close contact for radiating the heat by conduction. A first impact-absorbing structure is formed all around the FED panel together with a fragment glass scattering protection film. This first impact-absorbing structure is made to absorb more than half the whole impact applied to the set.

COPYRIGHT: (C)2007,JPO&INPIT