| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting crystal oscillator to enhance a productivity and a reliability by eliminating an under-fill to an IC chip. SOLUTION: In the surface mounting crystal oscillator comprised of fixing the IC chip 1 to an inner bottom face of a recess-shaped container main body 7 having an inner wall step portion, arranging a crystal piece 8 on an upside of the IC chip 1 and joining a metal cover 9 on an opening end face of the container main body 7, both sides of one end portion of a draw-out type electrode 11b drawn out of the crystal piece 8 are fixed to a second holding terminal 12b of a flat-shaped substrate 15 by a conductive adhesive 13. Then, a surface side of the flat-shaped substrate 15 is opposed to the inner wall step portion of the container main body 7 fixing the IC chip 1, and a first junction terminal 5a of the inner wall step portion and a second junction terminal 5b of the flat-shaped substrate 15 are connected by a solder. COPYRIGHT: (C)2007,JPO&INPIT
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