发明名称 INTEGRAL BONDING ATTACHMENT
摘要 An integral bonding attachment includes an insulated section of a conductive wire with an exposed, uninsulated section. A sleeve covers the insulated and uninsulated sections of the conductive wire, and the sleeve includes a flattened section encasing at least a portion of the uninsulated wire section to form a generally integral structure with the core of the conductive wire. At least one generally tubular section is positioned at an end of the flattened section to engage the insulated section of the conductive wire. An aperture may pass simultaneously through the inner core and flattened sleeve section for attaching the integral bonding attachment to a structure.
申请公布号 US2007224872(A1) 申请公布日期 2007.09.27
申请号 US20070754534 申请日期 2007.05.29
申请人 TENSOLITE COMPANY 发明人 CECIL DAVID C.;SUTHERLAND JACK E.
分类号 H01R4/24 主分类号 H01R4/24
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