| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor chips to which a normal carrying device or the like can be applied even if a divided semiconductor chip is being connected by a pressure-sensitive adhesive sheet for protecting the surface. SOLUTION: A wafer-dividing method comprises processes of: forming a groove having a cutting depth that is shallower than the thickness of a wafer along a circuit at the circuit surface side of the wafer in which a plurality of circuits are formed; laminating a fixing jig 3 on the circuit surface; and a grinding the back of the wafer for dividing into a group of chips until the groove is reached. In the wafer-dividing method, the fixing jig comprises a jig substrate 30 that has a plurality of projections 36 on one surface, and a sidewall having nearly the same height as that of the projections at the outer-periphery section on one surface, and an adhesive layer 31 that is laminated on a surface having the projections of the jig substrate and is adhered to the upper surface of the sidewall. A divided space is formed on a surface having the projections of the jig substrate by the adhesive layer, the projections, and the sidewall, and at least one through hole 38 penetrating the outside and the divided section is provided in the jig substrate. COPYRIGHT: (C)2007,JPO&INPIT
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